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The 3D BGA Reballing Stencil Template is designed for iPhone 6/6P/6S/6SP/SE/7/7P models, featuring laser-formed square holes for high accuracy and a user-friendly design that eliminates the need for a reballing station. Weighing only 10g and with a thickness of 0.25mm, this durable stencil is compatible with A8/A9/A10 series CPUs and ICs, making it an essential tool for efficient repairs.
Manufacturer | Lapartsmaster |
Is Discontinued By Manufacturer | No |
Pattern | A8 Series for iPhone6/6P |
Batteries Included? | No |
Batteries Required? | No |
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