* 100% New Heatsink plaster. * Application: apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET Heatsink，VGA CARD Northbridge Southbridge Heatsink. * Features: thermal properties, strong adhesion * Melting capacity: 0 (200 ℃ / 24Hours) * Evaporation: 0.001% (200 ℃ / 24Hours) * Thermal conductivity:> 1.2W/m-K * Thermal Impedance: <0.06 * Clotting time: 3min (25 ℃) * Strength of connected buildings: 25Kg * Insulation coefficient> 5.1 * Dissipation coefficient <0.005 * Temperature resistance: 200 ℃ * Net Weight: 10g Package Includes: 10 x 10g Thermal Heatsink Plaster Glue.
Trustpilot
1 day ago
1 week ago
