Specifications: 1. The total power: 3800W 2. Upper heating power: 800W 3. Bottom heating power: 800W, bottom infrared heating power: 2200W 4. Use single-phase 110V power: AC 60HZ 3KVA 5. Shape dimension: the body part 420 * 500 * 550MM 6. The temperature control: high-precision K type thermocouples. 7. Localization way: v-shaped fissure card slot PCB positioning, maximum adapt PCB size 320 * 375MM 8. Machine weight: about 28KG. Features: 1. With high precision temperature control instrument imported raw materials (PLC). J heater precise control of BGA desoldering process. 2. The machine USES three temperature area independent control, temperature control more accurate. The first temperature area. The second temperature area all can set 8 paragraph litre (drop) temperature + 8 section temperature control, can also store 10 team temperature curve. The third temperature area USES far infrared heating board preheat, independent temperature control, ensure the welding process of PCB can comprehensively preheating 3. The machine has the computer communication function, the built-in PC serial port, external temperature measuring interface, equipped with software, computer control can be realized 4. PCB positioning of the card slot, v-shaped fissure of flexible and convenient portable universal fixtures, to protect PCB. 5. For big heat capacity PCB and other high requirements, lead-free solder can easily handle. 6. Sirocco can rotate 360 degrees arbitrary time-and-labor-saving, easily replaced. Equipped with a variety of sizes sirocco can be customized tip special requirements. Suitable for laptop computer motherboard, desktop computer motherboard, etc. Large circuit board maintenance, and mobile phone motherboard such small small-sized chip maintenance
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